3D Virtual Instrument Cluster Solution

3D Virtual Instrument Cluster Solution

Our 3D virtual instrument cluster solution is built around a high-performance i.MX8 series quad-core CPU, paired with automotive-grade LPDDR4 memory and eMMC storage. The i.MX8 series processors support graphics, video, image processing, audio and voice functions, making them an ideal choice for applications with safety certification and high performance requirements. The BSP ships with highly optimized drivers and software, providing broad support for a wide range of embedded industrial and automotive applications.

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3D Virtual Instrument Cluster Solution

Our 3D virtual instrument cluster solution is built around a high-performance i.MX8 series quad-core CPU, paired with automotive-grade LPDDR4 memory and eMMC storage. The i.MX8 series processors support graphics, video, image processing, audio and voice functions, making them an ideal choice for applications with safety certification and high performance requirements. The BSP ships with highly optimized drivers and software, providing broad support for a wide range of embedded industrial and automotive applications.

Recommended Devices

  • i.MX8X series — i.MX8QXP: 4x Cortex®-A35 cores running at up to 1.2GHz; 1x Cortex®-M4 core for real-time signal processing; GPU GC7000L hardware graphics acceleration delivering up to 64GLOPS; 4K H265 hardware encoding and 1080p H264 hardware encoding/decoding; three display outputs, two of which are DSI/LVDS, up to 1080p@60; 1xPCIe 3.0, USB 2.0 and 3.0 OTG, 2xEthernet AVB, 3xCAN / CAN FD and more

Core Components

  • High-performance processor: IMX8QX6AVLFZAB (NXP)
  • CAN PHY: NXP, full part number available on request
  • PMIC: NXP, full part number available on request
  • Codec: NXP, full part number available on request
  • RTC: NXP, full part number available on request
  • EMMC: ISSI, full part number available on request
  • LPDDR4: ISSI, full part number available on request
  • Flash: ISSI, full part number available on request
  • DC-DC: MPS, full part number available on request

Key Advantages

  • Supports embedded Linux
  • Supports 2 MIPI/LVDS channels for dual-screen display, up to 1080p@60
  • GPU GC7000L hardware graphics acceleration, delivering up to 64GLOPS
  • Supports OpenGLES2.0 and OpenGLES3.1 for accelerated 3D model rendering

Reference Design Development kit part number: IMX8QXP-EVB

  • Multi-core architecture combining 4×Cortex®-A35 and 1×Cortex®-M4F cores; the Cortex®-A35 cores support Arm® virtualization extensions, while the Cortex®-M4F core is suited to real-time applications;
  • The graphics processing unit (GPU) supports OpenGL 3.0 and 2.1, OpenGL ES 3.1, 3.0, 2.0 and 1.1, OpenCL 1.2 and 1.1, OpenVG 1.1 and Vulkan;
  • External memory support for 40-bit, 933MHz DDR3 (with optional ECC protection) and 32-bit, 1200MHz LPDDR4 (without ECC protection);
  • A range of high-speed peripheral interfaces such as USB 3.0, PCIe 3.0 and Gigabit Ethernet;
  • 1× HIFI 4 DSP for pre-processing and post-processing, running at up to 640MHz;
  • Enhanced high-assurance boot and encrypted boot, with an on-the-fly encryption engine (AES-128) and 64kB secure RAM;
  • Suitable for automotive multimedia, industrial control, consumer electronics and similar fields

Functional Block Diagram

Functional Block Diagram
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